Revisiting power cycling test for better life-time prediction in traction-Reference-Cited by-同舟云学术

Revisiting power cycling test for better life-time prediction in traction

Published:2007-09 Issue:9-11 Volume:47 Page:1690-1695
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Mermet-Guyennet M.,Perpiñá X.,Piton M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Ciappa M, Fichtner W. Life-time prediction of IGBT modules for traction applications. In: Proceedings of IRPS; 2000.

2. Coquery G. Thermal cycling: first comparative tests on presspacked and direct bonding for GTOs and IGBTs. In: Proceedings of ESREF, 1993.

3. Coquery G, Lallemand R, Wagner D, Gibard P. Reliability of the 400A IGBT modules for traction converters. In: Proceedings of EPE, vol. 5; 1995. p. 219–34.

4. Reliability indicators for lift-off of bond wires in IGBT power modules;Farokhzad;Microelectron Reliab,1996

5. Auerbach F, Lenniger A. Power cycling stability of IGBT modules. IEEE Ind Appl Society, NO; 1997.

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Implementation of Controller for IGBT Moudle Performance Test;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16

2. Study on Lifetime Modeling of IGBT Modules Considering Electric Frequency Influence Mechanism;IEEE Transactions on Device and Materials Reliability;2023-09

3. Prediction of Defect Distribution in Solder Joint Using Device Stress Toward Prognostic Health Management of Power Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

4. A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules;Microelectronics Reliability;2022-10

5. Two Decades of Condition Monitoring Methods for Power Devices;Electronics;2021-03-15