Using RBF networks for detection and prediction of flip chip with missing bumps-Reference-Cited by-同舟云学术

Using RBF networks for detection and prediction of flip chip with missing bumps

Published:2015-12 Issue:12 Volume:55 Page:2817-2825
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liao Guanglan,Du Li^ORCID,Su Lei,Zeng Miao,Nie Lei,Shi Tielin

Funder

National Key Basic Research Special Fund of China

National Natural Science Foundation of China

Program for Changjiang Scholars and Innovative Research Team in University

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

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4. Minimal size packaging solutions: a comparison;Greathouse;Microelectron. Int.,1996

5. Cycling copper flip chip interconnects;Roesch;Microelectron. Reliab.,2004

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