Cycling copper flip chip interconnects-Reference-Cited by-同舟云学术

Cycling copper flip chip interconnects

Published:2004-07 Issue:7 Volume:44 Page:1047-1054
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Roesch William J,Jittinorasett Suwanna

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. Roesch WJ. Thermal excursion accelerating factors. In: 1999 GaAs REL Workshop, October 17, 1999, Monterey, CA

2. Mescher P, Scanlan, Erich, Parker, O'Brien. In: Proceedings of the Pan Pacific Microelectronics Symposium Conference, January 2000

3. Lu H, Hung KC, Stoyanov S, Bailey C, Chan YC. In: Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, 8 July 2001, Kauai, Hawaii

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