Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration

Author:

Wang Shuxiao,Wang Qing,Liu Yufei,Jia Lianxi,Yu Mingbin,Sun Peng,Geng Fei,Cai Yan,Tu Zhijuan

Funder

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

University of Chinese Academy of Sciences

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. From Chip to cloud: optical interconnects in engineered systems;Krishnamoorthy;J. Lightwave Technol.,2017

2. The next generation package technology for higher performance and smaller systems;Lee,2006

3. Roadmap on silicon photonics;Thomson;J. Opt.,2016

4. Through silicon via technology—processes and reliability for wafer-level 3D system integration;Ramm,2008

5. 22.2 A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI;Chen,2015

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