A novel approach for flip chip inspection based on improved SDELM and vibration signals-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A novel approach for flip chip inspection based on improved SDELM and vibration signals

Published:2022-02-24 Issue:5 Volume:65 Page:1087-1097
ISSN:1674-7321
Container-title:Science China Technological Sciences
language:en
Short-container-title:Sci. China Technol. Sci.

Author:

Su Lei,Zhang SiYu,Ji Yong,Wang Gang,Ming XueFei,Gu JieFei,Li Ke,Pecht Michael

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s11431-021-1964-0.pdf

Reference33 articles.

1. Su L, Yu X, Li K, et al. Defect inspection of flip chip solder joints based on non-destructive methods: A review. Microelectron Reliab, 2020, 110: 113657

2. Li J, Tian Q, Zhang H, et al. Study on dipping mathematical models for the solder flip-chip bonding in microelectronics packaging. IEEE Trans Ind Inf, 2018, 14: 4746–4754

3. Lu X N, Liu F, He Z Z, et al. Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm. Sci China Tech Sci, 2018, 61: 1426–1430

4. Wang F, Liang C, Tian Y, et al. Design of a piezoelectric-actuated microgripper with a three-stage flexure-based amplification. IEEE ASME Trans Mechatron, 2015, 20: 2205–2213

5. Su L, Wang L Y, Li K, et al. Automated X-ray recognition of solder bump defects based on ensemble-ELM. Sci China Tech Sci, 2019, 62: 1512–1519

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flip-chip solder bumps defect detection using a self-search lightweight framework;Advanced Engineering Informatics;2024-04

2. Predicting microbial extracellular electron transfer activity in paddy soils with soil physicochemical properties using machine learning;Science China Technological Sciences;2023-12-08

3. Intelligent defect inspection of flip chip based on vibration signals and improved gcForest;Measurement;2023-06

4. Data-driven unsupervised anomaly detection and recovery of unmanned aerial vehicle flight data based on spatiotemporal correlation;Science China Technological Sciences;2023-04-10

5. Small sample classification based on data enhancement and its application in flip chip defection;Microelectronics Reliability;2023-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3