Leakage current study and relevant defect localization in integrated circuit failure analysis-Reference-Cited by-同舟云学术

Leakage current study and relevant defect localization in integrated circuit failure analysis

Published:2015-02 Issue:3-4 Volume:55 Page:463-469
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wu Chunlei,Yao Suying,Corinne Bergès

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Photon emission microscopy;Shade,2004

2. Fundamentals of photon emission (PEM) in silicon-electroluminescence for analysis of electronic circuit and device functionality;Boit,2004

3. Layout analysis as supporting tool for failure localization: basic principles and case studies;Hartmann;Microelectron Reliab,2008

4. Novel OBIC observation method for detecting defects in Al stripes under current stressing;Nikawa;ISTFA,1993

5. OBIRCH analysis of electrically stressed advanced graphic ICs;Liao;Microelectron Reliab,2007

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