Design of Integrated Circuit Hard Defect Location System Based on Thermal Laser Stimulation-Reference-Cited by-同舟云学术

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Design of Integrated Circuit Hard Defect Location System Based on Thermal Laser Stimulation

Published:2022-11-11 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)
language:
Short-container-title:

Author:

Wu Wenjian¹,Ma Yingqi²,Cai Minghui²

Affiliation:

1. Chinese Academy of Sciences, University of Chinese Academy of Sciences,State Key Laboratory of Space Weather, National Space Science Center,Beijing,China

2. Chinese Academy of Sciences,State Key Laboratory of Space Weather, National Space Science Center,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10090225/10090247/10090341.pdf?arnumber=10090341

Reference15 articles.

1. Seebeck Effect Imaging to Improve Short Defect Localization

2. Secondary Spot for Pulsed Laser SEETesting [J];jiang;Atomic Energy Science and Technology,2013

3. Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysis

4. Research on Random Pulse Signal Detection and Its Segmentation and Acquisition Technology;yuelin;North Central University,2013

5. Backside Localization of Current Leakage Faults Using Thermal Laser Stimulation

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