Author:
Wang Yan,Zhu Qingguo,Huang Caiqing
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Metal-layer capacitors in the 65nm CMOS process and the application for low leakage power-rail ESD clamp circuit;Chiu;Microelectron. Reliab.,2014
2. Leakage current study and relevant defect localization in integrated circuit failure analysis;Chunlei;Microelectron. Reliab.,2015
3. Defect localization using photon emission microscopy analysis with the combination of OBIRCH analysis;Chunlei,2010
4. Application of PEM and OBIRCH to defect localization of integrated circuits;Jianwen;Adv. Mater. Res.,2014
5. Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue;Quah,2014
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