Author:
May Nicholas,Choi Hongbin,Phoulady Adrian,Suleiman Yara,DiMase Daniel,Tavousi Pouya,Shahbazmohamadi Sina
Funder
Defense Microelectronics Activity
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. The state-of-the-art in IC reverse engineering;Torrance,2009
2. Security analysis of integrated circuit camouflaging;Rajendran,2013
3. Copper wirebond package decapsulation technique using mixed acid chemistry;Ng,2012
4. Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis;Tang,2011
5. A mechanical decapsulation technique for epoxide-packaged semiconductor components;Chwastek;Qual. Reliab. Eng. Int.,1988
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献