Analysis of copper pillar bump interconnects for RF-filters-Reference-Cited by-同舟云学术

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Analysis of copper pillar bump interconnects for RF-filters

Published:2022-11 Issue: Volume:138 Page:114642
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Eulenkamp C.,Schober J.,Feiertag G.

Funder

Bayerische Staatsministerium für Wirtschaft, Landesentwicklung und Energie

Bayerisches Staatsministerium für Wirtschaft, Infrastruktur, Verkehr und Technologie

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Reliability study of miniaturized surface acoustic wave RF-filters with copper pillar bump interconnections;Schober;IEEE Access,2021

2. Effect of cu concentration on the reactions between sn-ag-cu solders and ni;Ho;J. Electron. Mater.,2002

3. Morphology and chemical composition of Ag/Sn/Ag interconnections;Skrzyniarz;J. Microsc.,2010

4. Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process;Li;Acta Mater.,2010

5. Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment;Li;J. Electron. Mater.,2014

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