Morphology and chemical composition of Ag/Sn/Ag interconnections

Author:

SKRZYNIARZ P.,WOJEWODA-BUDKA J.,WIERZBICKA-MIERNIK A.,ZIEBA P.

Publisher

Wiley

Subject

Histology,Pathology and Forensic Medicine

Reference11 articles.

1. Rapid formation of intermetallic compound by interdiffusion in the Cu-Sn and Ni-Sn systems;Bader;Acta Metall. Mater.,1995

2. Phase identification and growth kinetics of the intermetallic compounds formed during In-49Sn/Cu soldering reactions;Chuang;J. Electr. Mate.,2002

3. Diffusion soldering;Jacobson;Solder Surf. Mt. Tech.,1992

4. Diffusion soldering for electronics manufacturing;Humpston;Endevour, New Series,1994

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Analysis of copper pillar bump interconnects for RF-filters;Microelectronics Reliability;2022-11

2. Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-10

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