Author:
SKRZYNIARZ P.,WOJEWODA-BUDKA J.,WIERZBICKA-MIERNIK A.,ZIEBA P.
Subject
Histology,Pathology and Forensic Medicine
Reference11 articles.
1. Rapid formation of intermetallic compound by interdiffusion in the Cu-Sn and Ni-Sn systems;Bader;Acta Metall. Mater.,1995
2. Phase identification and growth kinetics of the intermetallic compounds formed during In-49Sn/Cu soldering reactions;Chuang;J. Electr. Mate.,2002
3. Diffusion soldering;Jacobson;Solder Surf. Mt. Tech.,1992
4. Diffusion soldering for electronics manufacturing;Humpston;Endevour, New Series,1994
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献