Void and solder joint detection for chip resistors based on X-ray images and deep neural networks-Reference-Cited by-同舟云学术

Void and solder joint detection for chip resistors based on X-ray images and deep neural networks

Published:2022-08 Issue: Volume:135 Page:114587
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Pang Shuiling,Chen Meiyun,Ta Shiwo,Wu Heng,Takamasu Kiyoshi

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

State Key Laboratory of Advanced Materials and Electronic Components, Guangdong Fenghua Advanced Technology Holding

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

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3. Void inspection in lead-free solder bumps on ball grid array (BGA) packages using laser ultrasound technique;Gong,2011

4. Evaluation of lead-free solder bump voiding ball grid array packages using laser ultrasound and interferometric technique;Ume;IEEE Trans. Compon. Packag. Manuf. Technol.,2013

5. Defect inspection of flip chip solder joints based on non-destructive methods: a review;Su;Microelectron. Reliab.,2020

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2. Convolutional Attention Network with edge supervision for void and spot segmentation in chip resistors based on X-ray images;Optics and Lasers in Engineering;2024-07

3. Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling;Heliyon;2024-06

4. X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5;NDT & E International;2024-04

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