Automatic detection of defects in electronic plastic packaging using deep convolutional neural networks
Author:
Funder
Science and Technology on Electronic Information Control Laboratory
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11554-024-01534-5.pdf
Reference33 articles.
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2. Wang, Z.J., Yi, Z.X., Qin, M., et al.: Low-drift MEMS thermal wind sensor with symmetric packaging using plastic injection molding process. IEEE Trans. Instrum. Meas. 70, 1–8 (2021)
3. Li, S.: MicroSystem Based on SiP Technology. Springer Nature Singapore, Singapore (2023)
4. Angelov, G., Rusev, R., Nikolov, D., et al.: Identifying of delamination in integrated circuits using surface acoustic microscopy. In: 2021 XXX International Scientific Conference Electronics (ET), Sozopol, Bulgaria, pp. 1–5. IEEE (2021)
5. Kravchenko, G., Bohm, C.: A study of chip top delamination in plastic encapsulated packages under temperature loading. In: 2007 9th Electronics Packaging Technology Conference, Singapore, pp. 675–679. IEEE (2007)
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