Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package-Reference-Cited by-同舟云学术

Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package

Published:2012-05 Issue:5 Volume:52 Page:855-860
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yang C.T.,Liu W.C.,Liu C.Y.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Spreading resistance of isoflux rectangles and strips on compound flux channels;Yovanovich;J Thermophys Heat Transfer,1999

5. Thermal spreading resistance in compound and orthotropic systems;Muzychka;J Thermophys Heat Transfer,2004

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