A review of thermal interface material fabrication method toward enhancing heat dissipation-Reference-Cited by-同舟云学术

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A review of thermal interface material fabrication method toward enhancing heat dissipation

Published:2020-10-20 Issue:3 Volume:45 Page:3548-3568
ISSN:0363-907X
Container-title:International Journal of Energy Research
language:en
Short-container-title:Int J Energy Res

Author:

Bahru Raihana¹^ORCID,Zamri Mohd Faiz Muaz Ahmad²^ORCID,Shamsuddin Abd Halim²,Shaari Norazuwana³,Mohamed Mohd Ambri¹^ORCID

Affiliation:

1. Institute of Microengineering and Nanoelectronics (IMEN) Universiti Kebangsaan Malaysia Bangi Malaysia

2. Institute of Sustainable Energy (ISE) Universiti Tenaga Nasional Kajang Malaysia

3. Institute of Fuel Cell Universiti Kebangsaan Malaysia Bangi Malaysia

Funder

Universiti Kebangsaan Malaysia

Publisher

Wiley

Subject

Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/er.6078

Reference137 articles.

1. Thermal Interface Materials

2. Emerging challenges and materials for thermal management of electronics

3. Introductory Chapter: Electronics Cooling — An Overview

4. Superior thermal interface materials for thermal management

5. Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

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