Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate
Author:
Funder
UNSW
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference31 articles.
1. Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications
2. Transient liquid phase Ag-based solder technology for high-temperature packaging applications
3. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
4. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties
5. Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles
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