Transient liquid phase Ag-based solder technology for high-temperature packaging applications
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference19 articles.
1. High-temperature creep and hardness of eutectic 80Au/20Sn solder
2. Interfacial reactions between high-Pb solders and Ag
3. Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials
4. Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
5. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders
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