The study of Ni-Sn transient liquid phase bonded joints under high temperatures
Author:
Funder
Nanyang Technological University
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times;Yan;Mater. Charact.,2022
2. Transient liquid phase Ag-based solder technology for high-temperature packaging applications;Sharif;J. Alloys Compd.,2014
3. Ag@Sn core-shell powder preform with a high re-melting temperature for high-temperature power devices packaging;Yu;Adv. Eng. Mater.,2018
4. Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles;Sun;J. Mater. Process. Technol.,2022
5. Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints;Sun;J. Alloys Compd.,2019
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