Ag@Sn Core-Shell Powder Preform with a High Re-Melting Temperature for High-Temperature Power Devices Packaging
Author:
Affiliation:
1. Materials Science and Engineering Department, Shenzhen Graduate School, Harbin Institute of Technology; Shenzhen, 518055 China
2. Hoerson Electronics Technology Co.; Ltd. Shenzhen, 518126 China
Funder
National Natural Science Foundation of China
Science and Technology Project of Shenzhen
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201700524/fullpdf
Reference31 articles.
1. Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
2. SiC Die Attach for High-Temperature Applications
3. SiC Power Device Die Attach for Extreme Environments
4. Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications
5. Tin–lead (SnPb) solder reaction in flip chip technology
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