Formation of intermetallic compounds in reaction between Cu–Ni alloys and solid Sn – a new look at the prominent effect of Ni

Author:

Kodentsov Alexander,Wojewoda-Budka Joanna,Litynska-Dobrzynska Lidia,Zieba Pawel,Wierzbicka-Miernik Anna

Funder

Polska Akademia Nauk

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference52 articles.

1. Reaction-diffusion in the Cu-Sn system;Onishi;Trans. JIM,1975

2. Analysis of low-temperature intermetallic growth in copper-tin diffusion couples;Mei;Met. Trans A,1992

3. Intermetallic growth and Kirkendall effect manifestations in Cu/Sn and Au/Sn diffusion couples;Paul;Z. Metallkd.,2004

4. Diffusion parameters and growth mechanism of phases in the Cu-Sn System;Paul;Metall. Mater. Trans.,2011

5. The Kirkendall Effect in Solid State Diffusion;Paul,2004

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