Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System-Reference-Cited by-同舟云学术

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

Published:2011-01-07 Issue:4 Volume:42 Page:952-963
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Paul A.,Ghosh C.,Boettinger W. J.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-010-0592-9.pdf

Reference39 articles.

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2. Z. Mei, A.J. Sunwoo, and J.W. Morris: Metall. Trans. A, 1992, vol. 23A, pp. 857–64.

3. D.B. Butrymowicz: International Copper Research Association, Diffusion Rate Data and Mass Transport Phenomena for Copper Systems—Part II, INCRA Monograph Series V (International Copper Research Association), Diffusion in Metals Data Center, National Bureau of Standards, Washington, DC, 1981, pp. 398–475.

4. L.C.C. da Silva and R.F. Mehl: Trans. AIME, 1951, vol. 191, pp. 155–73.

5. H. Oikawa and A. Hosoi: Scripta Metall., 1975, vol. 9, pp. 823–28.

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