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Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5

  • Published:2007-07 Issue:1-2 Volume:438 Page:100-105
  • ISSN:0925-8388
  • Container-title:Journal of Alloys and Compounds
  • language:en
  • Short-container-title:Journal of Alloys and Compounds

Author:

Zhu Fulong,Zhang Honghai,Guan Rongfeng,Liu Sheng

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference10 articles.

1. The Second International Symposium on Electronic Packaging Technology;Lu,1996

2. Sensing Modeling and Simulation in Emerging Electronic Packaging, vol. 17;Lu,1996

3. Proceedings of the 49th Electronic Components and Technology Conference;Ren,1999

4. Proceedings of the 47th Electronic Components and Technology Conference;Lu,1997

5. Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester
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