Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester-Reference-Cited by-同舟云学术

Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester

Published:1999-01 Issue:1 Volume:36 Page:65-78
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Lu Minfu,Qian Zhengfang,Ren Wei,Liu Sheng,Shangguan Dongkai

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference9 articles.

1. The large strain compression, tension, and simple shear of polycarbonate

2. Liu, S., Zhu, J., Hu, J.M., Pao, Y.H., 1995. Investigation of crack propagation in ceramic\adhesive\glass systems, IEEE Trans., CHMT, Sept.

3. Lu, M., Ren, W., Liu, S.A., 1996. Unique multi-axial thermo-mechanical fatigue tester for electronic packaging materials. The Second International Symposium on Electronic Packaging Technology. Shanghai, Dec. 9–12, China.

4. The Newport Catalog, 96\97, Newport Corporation, 1996.

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading;Fatigue & Fracture of Engineering Materials & Structures;2022-04-20

2. Concept of a Mechanical Test Setup for Packaging Materials Using Digital Image Correlation Methods;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19

3. Characterization of Failed Surface of Ti and Imidex (PI) Film for Different Inter-layer Thicknesses of Ti Film;Journal of Materials Engineering and Performance;2012-01-03

4. Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution;Modeling and Simulation for Microelectronic Packaging Assembly;2011-09-02

5. Finite element thermal/mechanical analysis for microscale laser joining of ultrathin coatings of titanium on glass/polyimide system;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2011-08-25