Reliability studies of Sn–9Zn/Cu solder joints with aging treatment
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Advances in lead-free electronics soldering
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
4. Lead-free Solders in Microelectronics
5. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
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1. Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints;Journal of Materials Science: Materials in Electronics;2024-01
2. Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy;Journal of Materials Engineering and Performance;2023-05-22
3. Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures;Journal of Electronic Materials;2021-07-29
4. Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples;Journal of Electronic Materials;2021-01-08
5. Pb-free solder—microstructural, material reliability, and failure relationships;Handbook of Materials Failure Analysis;2020
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