Interface microstructure evolution of a novel CuW/Al composite fabricated by an infiltration method-Reference-Cited by-同舟云学术

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Interface microstructure evolution of a novel CuW/Al composite fabricated by an infiltration method

Published:2020-03 Issue: Volume:816 Page:152506
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Wang Chan,Liang Shuhua,Cao Fei,Zhang Qiao

Funder

National Natural Science Foundation of China

Key Research and Development Project of Shaanxi Province

Shaanxi Key Laboratory Program

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference57 articles.

1. Mechanical and microstructural investigation of Zn/Sn multilayered composites fabricated by accumulative roll bonding (ARB) process;Mashhadi;J. Alloy. Comp.,2017

2. Compressive mechanical behavior of Al/Mg composite rods with different types of sleeve;Feng;Acta Mater.,2016

3. Microstructure and mechanical properties of amorphous strip/aluminum laminated composites fabricated by ultrasonic additive consolidation;Wang;Mater. Sci. Eng. A,2019

4. Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography;Wang;J. Alloy. Comp.,2014

5. Effect of alloying interlayer on interfacial bond strength of CuW/CuCr integral materials;Yang;Mater. Sci. Eng. A,2010

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1. Novel Synthesis of CuW Composite Containing Micro- and Nano-tungsten Particles Coated with SixWy Phase via Silicothermic Coupling with Aluminothermic Reduction;JOM;2024-04-12

2. Ta/Al/CuW low temperature ohmic contacts for GaN-on-Si HEMT;Microelectronic Engineering;2024-03

3. Improvement on interfacial properties of CuW and CuCr bimetallic materials with high-entropy alloy interlayers via infiltration method;Science and Engineering of Composite Materials;2024-01-01

4. The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite;Vacuum;2023-08

5. Microstructure evolution and mechanical properties of CuW/Al interface fabricated by infiltration and vacuum hot-pressing diffusion bonding;Vacuum;2023-04

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