Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference15 articles.
1. Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
2. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
3. Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
4. Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints
5. Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
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1. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
2. Effect of Ag and Cu co-addition on the microstructure evolution, interface behavior and mechanical properties of Sn-5Sb based solder joints subjected to different thermal aging conditions;Microelectronics Reliability;2022-12
3. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2022-10-05
4. Influence mechanism of Au layer thickness on wettability of Sn–Ag–Cu solder on heated ENIG pads;Vacuum;2022-07
5. Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review;Materials;2022-02-15
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