Aging and Cu concentration effects on Sn–9Zn–xCu/Au couples
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
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2. Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate;Materials Research Express;2019-04-24
3. Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys;Journal of Electronic Materials;2018-08-13
4. Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples;Journal of Alloys and Compounds;2017-07
5. Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature;Transactions of the Indian Institute of Metals;2017-04-07
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