Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature
Author:
Funder
the Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/article/10.1007/s12666-017-1104-z/fulltext.html
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