Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Lead-free Solders in Microelectronics
3. Advances in lead-free electronics soldering
4. Wetting and interface microstructure between Sn–Zn binary alloys and Cu
5. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
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4. Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2023-02-21
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