Microstructure characterization of Sn-Ag solder joints between stud bumps and metal pads-Reference-Cited by-同舟云学术

Microstructure characterization of Sn-Ag solder joints between stud bumps and metal pads

Published:2003-12 Issue:12 Volume:32 Page:1448-1454
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Shin Mu-Seob,Kim Young-Ho

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0114-2.pdf

Reference17 articles.

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2. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), pp. 1–82.

3. K.N. Tu and K. Zeng, Mater. Sci. Eng. R 34, 1 (2001).

4. C.L. Wong and J. How, IEEE/CPMT Electronic Packaging Technology Conf. (New York: IEEE, 1997), pp. 244–250.

5. F. Ferrando, J.-F. Zeberli, P. Clot, and J.-M. Chenuz, Proc. of 4th Int. Conf. on Adhesive Joining and Coating Technology in Electronics Manufacturing (Piscataway, NJ: IEEE, 2000), pp. 205–211.

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