Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump-Reference-Cited by-同舟云学术

Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump

Author:

Ha Sang-Su¹,Jung Seung-Boo²

Affiliation:

1. Technology Quality and Reliability, Quality and Reliability Team System LSI Business, Samsung Electronics Co., Ltd.

2. School of Advanced Materials Science and Engineering, Sungkyunkwan University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

Reference10 articles.

1. 1) C. Lee, A. Yeo and T. A. Min: Proc. 1st Electronic System Integration Technology Conference, (Sep 2009) pp. 1032–1039.

2. 2) Z. Wei, C. Y. Poo and L. S. Waf: Proc. 7th Electronic Packaging and Technology Conference, (2005) pp. 509–514.

3. 3) J. H. Lau: Flip Chip Technologies, (McGraw-Hill, New York, 1996) pp. 1–76.

4. 4) C. Wong and J. How: Electron. Packag. Technol. Conf., (1997) pp. 244–250.

5. 5) S. Ganesan and M. Pecht: Lead-Free Electronics, (John Wiley and Sons, INC., Publication) pp. 139–222.

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