First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Advances in lead-free electronics soldering
2. W.J. Boettinger, C.A. Handwerker, U.R. Kattner, in: F.G. Yost, F.M. Hosking, D.R. Frear (Eds.), The Mechanics of Solder Alloy Wetting and Spreading, New York, 1993, p. 103.
3. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis
4. Effect of aging on fatigue crack growth at sn-pb/cu interfaces
5. Discussion: “Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading” (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460–466)
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of rare earth elements scandium on Sn-0.7Cu brazing metal: First-principles calculation;Surfaces and Interfaces;2024-09
2. The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases;Journal of Phase Equilibria and Diffusion;2023-06
3. Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study;Alexandria Engineering Journal;2023-03
4. Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations;Materials Science and Engineering: A;2022-10
5. Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study;Journal of Materials Research and Technology;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3