Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference52 articles.
1. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J Mater Sci,2009
2. Mechanical characterization of intermetallic compounds in SAC solder joints at elevated temperatures;Fahim,2018
3. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Bharath Krupa Teja;J Mater Sci,2022
4. Strain-and strain-rate-dependent mechanical properties and behaviors of Cu 3 Sn compound using molecular dynamics simulation;Cheng;J Mater Sci,2012
5. Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3. 5Ag0. 5Cu composite solder/Cu during soldering;Tsao;J Alloys Compd,2011
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