Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
Author:
Funder
National Foundation for Science and Technology Development
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference41 articles.
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2. Mechanical properties of Pb-free SnAg solder joints;Keller;Acta Mater.,2011
3. Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders;El-Daly;Mater. Des.,2013
4. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt%Ag solder;Ochoa;J. Electron. Mater.,2003
5. New Pb-free solder alloy with superior mechanical properties;McCormack;Appl. Phys. Lett.,1993
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