Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
Author:
Funder
National Foundation for Science and Technology Development
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference41 articles.
1. Implementing Lead-free Electronics;HWang,2004
2. Mechanical properties of Pb-free SnAg solder joints;Keller;Acta Mater.,2011
3. Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders;El-Daly;Mater. Des.,2013
4. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt%Ag solder;Ochoa;J. Electron. Mater.,2003
5. New Pb-free solder alloy with superior mechanical properties;McCormack;Appl. Phys. Lett.,1993
Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies;Journal of Materials Research and Technology;2023-07
2. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection;ACTA METALL SIN;2023
3. Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints;Scientific Reports;2023-05-26
4. Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix;Journal of Materials Science;2023-02-22
5. Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder;Microelectronics Reliability;2023-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3