Funder
National Natural Science Foundation of China
National Key Research and Development Program of China
Universities of Shandong Province
State Key Laboratory for Advanced Metals and Materials
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference42 articles.
1. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
2. Advances in high-performance thermal management materials - a review;Zweben;J. Adv. Mater.,2007
3. Powder metallurgy processing of thermal management materials for microelectronic applications;German;Int. J. Powder Metall.,1994
4. On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites;Weber;Scripta Mater.,2007
5. Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route;Grzonka;Mater. Char.,2015
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