Fabrication and evaluation of high-performance 3D interpenetrated network structures SiC/Al composites with high-purity plate-like α-SiC framework

Author:

Xie Jiawei,Zou Jinhui,Tong Liangcheng,Wong SyieluingORCID,Guo XinORCID,Qin Hang,Gao Pengzhao,Guo Wenming,Xiao Hanning

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Electronic, Optical and Magnetic Materials

Reference57 articles.

1. Advances on thermally conductive epoxy-based composites as electronic packaging underfill materials-a review;Wen;Adv Mater,2022

2. Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management;Cui;Nat Commun,2021

3. The red deer antler: bioinspired design of an Al-Si composite with a fenestrated network-particle structure;Wang;J Materiomics,2020

4. Synthesis of nearly spherical AlN particles by an in-situ nitriding combustion route;Wei;J Adv Ceram,2021

5. A method to prepare TEM specimens by focused ion beam milling for Cu/diamond composites;Wang;Microsc Microanal,2018

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