Affiliation:
1. National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics , Nanjing 210016 , China
Abstract
Abstract
Mo2C layer was generated on the diamond surface via vacuum micro-evaporating, which was used as the reinforcement particles to fabricate diamond/Cu composites by spark plasma sintering (SPS). The effect of evaporation parameters on the forming of Mo2C, and the holding time on diamond/Cu composites fabrication is studied. Combined with the experiment and finite element analysis (FEA), the holding time on diamond/Cu composites influence on the thermal conductivity (TC) of composites is further discussed. The results show that the Mo2C area on the diamond surface would gradually enlarge and cover the diamond surface evenly with the increment in evaporation time and temperature, better vacuum micro-evaporating parameters were given as 1,000°C for 60 min. The fractures in the diamond/Cu composites are mainly ductile fractures on copper and diamond falling out from the Mo2C interface. It was found that sintering time would significantly influence the dissipation property of diamond/Cu composites. A comprehensive parameter for SPS was obtained at 900°C, 80 MPa for 10 min, the relative density (RD) and TC of the composites obtained under the parameter were 96.13% and 511 W/(m K). A longer sintering time would damage the Mo2C interlayer and further decrease the bonding between copper matrix and diamond particles, which would lower the RD and TC of composites. It can be obtained from the comparison of simulation results and experimental results that the FEA result is closer to the experimental results due to the gaps with low heat conduction, and the air in the gaps is added in the simulation process.
Reference47 articles.
1. Dai SG, Li JW, Lu NX. Research progress of diamond/copper composites with high thermal conductivity. Diam Relat Mater. 2020;108:107993.
2. Chen MH, Li HZ, Wang CR, Wang N, Li ZY, Tang LN. Progress in heat conduction of diamond/Cu composites with high TC. Rare Met Mater Eng. 2020;49:12.
3. Yuan MY, Tan ZQ, Fan GL, Xiong DB, Guo Q, Guo CP, et al. Theoretical modelling for interface design and TC prediction in diamond/Cu composites. Diam Relat Mater. 2018;81:38–44.
4. Li YQ, Zhou HY, Wu CJ, Yin Z, Liu C, Huang Y, et al. The interface and fabrication process of diamond/cu composites with nanocoated diamond for heat sink applications. Metals. 2021;11:196.
5. Wang LH, Li JW, Che ZF, Wang XT, Zhang HL, Wang JG, et al. Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites. J Alloy Compd. 2018;749:1098–105.