Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route
Author:
Funder
TERMET project
European Regional Development Fund
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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4. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites;Weber;Scr. Mater.,2007
5. Alloy development for highly conductive thermal management materials using copper–diamond composites fabricated by field assisted sintering technology;Rape;J. Mater. Sci.,2012
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