First-principles comparative study on diamond/carbide combinations: Interfacial adhesion and bonding nature
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Elsevier BV
Reference75 articles.
1. Diamond electrochemistry at the nanoscale: a review;Yang;Carbon,2016
2. Research progress in interface modification and thermal conduction behavior of diamond/metal composites;Zhu;Int. J. Miner. Metall. Mater.,2022
3. Optimized AgCuSnTi filler alloy for brazing of diamond/copper combination used in microwave windows: microstructure and mechanical performance;Xu;Vacuum,2023
4. Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy;Liu;Mater. Sci. Eng. A,2020
5. An investigation on the vacuum brazed diamond film and copper using low-temperature Ag-Cu-Sn-Ti filler alloys: interfacial microstructure and mechanical performance;Xu;J. Nucl. Mater.,2023
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