An investigation on the vacuum brazed diamond film and copper using low-temperature Ag-Cu-Sn-Ti filler alloys: Interfacial microstructure and mechanical performance-Reference-Cited by-同舟云学术

An investigation on the vacuum brazed diamond film and copper using low-temperature Ag-Cu-Sn-Ti filler alloys: Interfacial microstructure and mechanical performance

Published:2023-08 Issue: Volume:581 Page:154439
ISSN:0022-3115
Container-title:Journal of Nuclear Materials
language:en
Short-container-title:Journal of Nuclear Materials

Author:

Xu Haitao,Li Yafei,Lu Chuanyang,Li Huaxin,Zheng Wenjian,Ma Yinghe,Gao Zengliang,Yang Jianguo^ORCID,He Yanming

Publisher

Elsevier BV

Subject

Nuclear Energy and Engineering,General Materials Science,Nuclear and High Energy Physics

Reference49 articles.

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