Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy-Reference-Cited by-同舟云学术

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Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy

Published:2020-07 Issue: Volume:790 Page:139711
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Liu Zhuo,Liao Xinjiang,Fu Wei,Mu Dekui,Xu Xipeng,Huang Han

Funder

National Natural Science Foundation of China

Australia Research Council

Huaqiao University

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference52 articles.

1. Diamond-metal interfaces in cutting tools: a review;Artini;J. Mater. Sci.,2012

2. Diamond electrochemistry at the nanoscale: a review;Yang;Carbon N. Y.,2016

3. High temperature application of diamond power device;Umezawa;Diam. Relat. Mater.,2012

4. Large radius of curvature micro-lenses on single crystal diamond for application in monolithic diamond Raman lasers;Liu;Diam. Relat. Mater.,2016

5. An experimental investigation of temperatures in grinding of ceramics with a brazed diamond tool;Xiang;Adv. Mater. Res.,2014

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2. Microstructure and mechanical properties of Al₂O₃ ceramic and copper joints brazed with AgCuInTi brazing alloy;International Journal of Applied Ceramic Technology;2024-06-22

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