Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference13 articles.
1. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications;Schubert;Mater Sci Eng A,2008
2. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites;Weber;Scripta Mater,2007
3. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications;Schubert;Scripta Mater,2008
4. Optimum conditions for pressureless infiltration of SiCp performs by aluminum alloys;Pech-Canul;J Mater Process Technol,2000
5. Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp/Al metal matrix composites;Lee;Mater Sci Technol,2003
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