Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
Author:
Publisher
Elsevier BV
Subject
General Engineering,Ceramics and Composites
Reference13 articles.
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3. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications;Schubert;Scripta Mater,2008
4. Optimum conditions for pressureless infiltration of SiCp performs by aluminum alloys;Pech-Canul;J Mater Process Technol,2000
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