A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites-Reference-Cited by-同舟云学术

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A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Published:2024-09 Issue: Volume: Page:113654
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Bai Guangzhu^ORCID,Li Jianwei,Zhang Yongjian,Wang Changrui,Wang Xitao,Zhang Hailong

Funder

Jiangsu Province Natural Science Foundation

Harbin Institute of Technology State Key Laboratory of Advanced Welding and Joining

China Postdoctoral Science Foundation

Shaanxi Province Department of Science and Technology

Shanxi Provincial Education Department

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference35 articles.

1. Emerging challenges and materials for thermal management of electronics, Mater;Moore;Today,2014

2. Thermal materials solve power electronics challenges, Power Electron;Zweben;Technol.,2006

3. Thermal conductivity of Al-SiC composites with monomodal and bimodal particle size distribution;Molina;Mater. Sci. Eng. A,2008

4. Microstructures, mechanical and thermal properties of diamonds and graphene hybrid reinforced laminated Cu matrix composites by vacuum hot pressing;Luo;Vacuum,2023

5. Atmospheric plasma sprayed Cu coating on Cu-B/diamond composite for electronic packaging application;Zhang;Vacuum,2024

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