Thermal conductivity of Al–SiC composites with monomodal and bimodal particle size distribution-Reference-Cited by-同舟云学术

Thermal conductivity of Al–SiC composites with monomodal and bimodal particle size distribution

Published:2008-05 Issue:1-2 Volume:480 Page:483-488
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Molina J.M.,Narciso J.,Weber L.,Mortensen A.,Louis E.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

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2. Metal-matrix composites for electronic packaging

3. Advances in composite materials for thermal management in electronic packaging

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