Electromigration in 3D-IC scale Cu/Sn/Cu solder joints-Reference-Cited by-同舟云学术

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Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

Published:2016-08 Issue: Volume:676 Page:361-368
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Ho Cheng-En,Lee Pei-Tzu,Chen Chih-Nan,Yang Cheng-Hsien

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference29 articles.

1. Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy;Tu;Microelectron. Reliab.,2013

2. Constitution of Binary Alloys;Hansen,1958

3. Electromigration of gold and silver in single crystal tin;Shi;J. Phys. Chem. Solids,1987

4. Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction;Wu;Appl. Phys. Lett.,2004

5. Interstitial diffusion of copper in tin;Dyson;J. Appl. Phys.,1967

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1. The role of Sn grain orientation in Cu depletion of Sn-based solders;Modelling and Simulation in Materials Science and Engineering;2024-07-05

2. Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study;Surface and Coatings Technology;2024-05

3. Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density;International Journal of Heat and Mass Transfer;2023-03

4. In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish;Electronic Materials Letters;2023-01-07

5. A Short Review: Reliability Issues of Lead-Free Sn-Based Alloys for Superconducting Applications;Springer Proceedings in Physics;2023

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