Author:
Zhang J.S.,Chan Y.C.,Wu Y.P.,Xi H.J.,Wu F.S.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Electromigration and Electronic Device Degradation,1994
2. Lead(Pb)-free packaging strategy 2000–2003;Hayward;AMD,2001
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2002
4. Recent advances on electromigration in very large scale integration of interconnects;Tu;J. Appl. Phys.,2003
5. Electromigration of Sn–Pb–Ni and Sn–Pb–Cu solder bumps in flip-chip packages;Lai,2004
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献