An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
Author:
Affiliation:
1. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
2. Department of Microsystem Integration, Beijing Institute of Aerospace Control Devices, Beijing, China
Publisher
Informa UK Limited
Link
https://www.tandfonline.com/doi/pdf/10.1080/01694243.2024.2336177
Reference23 articles.
1. New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
2. Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints
3. Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint
4. Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints
5. Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of βSn grain orientations on the electromigration-induced evolution of voids in SAC305 BGA solder joints;Materials Characterization;2024-09
2. Numerical and experimental study on effect of induction heating parameters on the coating of Zn layer on mild steel;Journal of Adhesion Science and Technology;2024-05-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3