Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards-Reference-Cited by-同舟云学术

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Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards

Published:2008-07 Issue:1-2 Volume:459 Page:225-231
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Lin Ching-Tsung,Hsi Chi-Shiung,Wang Moo-Chin,Chang Tao-Chih,Liang Ming-Kann

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference28 articles.

1. Reliability studies of Sn–9Zn/Cu solder joints with aging treatment

2. Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders

3. New Pb‐free solder alloy with superior mechanical properties

4. Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

5. Interfacial microstructure and shear behavior of Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bi-Sn-Zn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30

2. Al-Sn-Zn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30

3. On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates;Journal of Alloys and Compounds;2019-06

4. Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment;Microelectronics Reliability;2018-03

5. Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering;Journal of Materials Processing Technology;2015-09

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