Interfacial microstructure and shear behavior of Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
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1. Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method;Journal of Materials Science: Materials in Electronics;2020-05-03
2. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints;Materials;2019-03-22
3. Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment;Microelectronics Reliability;2018-03
4. High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys;Journal of Materials Science: Materials in Electronics;2017-02-04
5. The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering;Journal of Electronic Materials;2016-12-19
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