Investigation of preparation and characteristics of Sn–Bi eutectic powders derived from a high shear mechanical approach
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip
2. Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
3. Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
4. Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
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1. Effect of nano-phased bismuth–tin alloy surface coating on tribo-mechanical properties of basalt fiber reinforced composites;Journal of Materials Research and Technology;2022-11
2. Large-Scale Sonochemical Synthesis of Bi–Sn Eutectic Alloy Nanoparticles;Journal of Nanoscience and Nanotechnology;2020-05-01
3. Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder;Journal of Materials Science: Materials in Electronics;2019-02-23
4. Electrodeposition of SnBi coatings based on deep eutectic solvent;Surface Engineering;2013-12-06
5. Improvement of mechanical properties of Sn–58Bi alloy with multi-walled carbon nanotubes;Transactions of Nonferrous Metals Society of China;2012-12
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